THERMODYNAMIC RESTRICTIONS ON SURFACE STRESS, AND ITS ESHELBIAN FORMS, FOR AN INTERFACE DRIVEN BY MECHANICAL, THERMAL AND CHEMICAL FORCES WITH APPLICATIONS TO SNBI SOLDER JOINTS

This thesis explores the thermodynamics and mechanics of reaction-diffusion interfaces in solid materials, focusing on configurational forces for bulks and surfaces, which are essential in understanding phenomena like electromigration, phase separation, and void evolution. The work is divided into four themes: bulk and surface configurational mechanics, electromigration in solder joints, and solid mixture theory. The thesis develops theories based on continuum mechanics and configurational forces, deriving Eshelby stress tensors and balance laws for interfaces. Experimental work on electromigration in SnBi solder joints is used to validate the theory. The research contributes to advancing the understanding of solid-state diffusion and phase evolution in engineering materials.