<b>Development of Microstructural fingerprint To secure Microelectronic packages using X-rays</b>

<p dir="ltr">Microelectronic package security is critical for the future of the semiconductor ecosystem. Multiple methods for package security exist, such as barcodes, RFID tags, and botanical markings. However, they suffer from multiple limitations, including easy detection and duplication. In this work, I will discuss a novel microstructural fingerprinting strategy for semiconductor packages using x-ray curing and imaging. A physical microstructural fingerprint is generated from a random distribution of 2^nd phase particles in a resin composite. We use x-ray curing of a photopolymer with Tantalum particles to develop particle reinforced resin matrix composites. Time-resolved x-ray radiographs taken during curing were used to study heterogeneity in curing. We have also carried out Discrete Elements Method (DEM) simulations to model particle movement in the resin matrix. The “sinking velocity” of particles was measured to determine the effects of particle size ration and particle-particle interactions on drift of particles through the resin. Our study with LIGGGHTS suggests that distribution can be further fine-tuned to control particle flow across the sample. Finally, we discuss preliminary shear peel testing to quantify adhesion strength of the fingerprints.</p>